Method for manufacturing semiconductor devices having a metallisation layer

ABSTRACT

A method for manufacturing semiconductor devices is disclosed. In one embodiment a semiconductor substrate having a first surface, a second surface opposite to the first surface and a plurality of semiconductor components is provided. The semiconductor substrate has a device thickness. At least one metallization layer is formed on the second surface of the semiconductor substrate. The metallization layer has a thickness which is greater than the device thickness.

This description refers to embodiments of methods for manufacturingsemiconductor devices having a thick metallisation. Embodiments relateto semiconductor devices, and in one embodiment to power semiconductordevices.

BACKGROUND

In order to improve the device characteristics of semiconductor devicesattempts have been made to reduce the final thickness of thesemiconductor material, particularly for power semiconductor devices. Itis desired that the semiconductor chip of such devices has a thicknesswhich is just sufficient for accommodating the device or circuit.

The manufacturing and handling of thin semiconductor chips and wafers iscomplicated since the brittle semiconductor material, once thinned, isprone to breaking. To improve the mechanical stability of thinnedsemiconductor material during manufacturing, carrier systems have beendeveloped. When finally detaching thin semiconductor chips from suchcarrier systems, the thin chips may break.

For these and other reasons there is a need for the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of embodiments and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments andtogether with the description serve to explain principles ofembodiments. Other embodiments and many of the intended advantages ofembodiments will be readily appreciated as they become better understoodby reference to the following detailed description. The elements of thedrawings are not necessarily to scale relative to each other. Likereference numerals designate corresponding similar parts.

FIGS. 1A to 1K illustrate processes of a method for manufacturingsemiconductor devices according to one embodiment.

FIG. 2 illustrates a final structure of a semiconductor device accordingto an embodiment.

FIGS. 3A to 3C illustrate processes of a method for manufacturingsemiconductor devices according to one embodiment.

FIGS. 4A to 4B illustrate processes of a method for manufacturingsemiconductor devices according to one embodiment.

FIGS. 5A to 5C illustrate processes of a method for manufacturingsemiconductor devices according to one embodiment.

FIGS. 6A to 6E illustrate processes of a method for manufacturingsemiconductor devices according to one embodiment.

FIGS. 7A to 7E illustrate processes of a method for manufacturingsemiconductor devices according to one embodiment.

FIGS. 8A to 8E illustrate processes of a method for manufacturingsemiconductor devices according to one embodiment.

DETAILED DESCRIPTION

In the following Detailed Description, reference is made to theaccompanying drawings, which form a part hereof, and in which are shownby way of illustration specific embodiments in which the invention maybe practiced. In this regard, directional terminology, such as “top”,“bottom”, “front”, “back”, leading”, “trailing” etc., is used withreference to the orientation of the Figure(s) being described. Becausecomponents of embodiments can be positioned in a number of differentorientations, the directional terminology is used for purpose ofillustration and is in no way limiting. It is to be understood thatother embodiments may be utilised and structural or logical changes maybe made without departing from the scope of the present invention. Thefollowing detailed description, therefore, is not to be taken in alimiting sense, and the scope of the present invention is defined by theappended claims. The embodiments being described use specific language,which should not be construed as limiting the scope of the appendedclaims.

It is to be understood that features of the various exemplaryembodiments described herein may be combined with each other, unlessspecifically noted otherwise. For example, features illustrated ordescribed as part of one embodiment can be used in conjunction withfeatures of other embodiments to yield yet a further embodiment. It isintended that the present description includes such modifications andvariations.

The term “lateral” as used in this specification intends to describe anorientation parallel to the main surface of a semiconductor substrate.

The term “vertical” as used in this specification intends to describe anorientation, which is arranged perpendicular to the main surface of thesemiconductor substrate.

In this specification, a second surface of a semiconductor substrate isconsidered to be formed by the lower or backside surface while a firstsurface is considered to be formed by the upper, front or main surfaceof the semiconductor substrate. The terms “above” and “below” as used inthis specification therefore describe a relative location of astructural feature to another structural feature with consideration ofthis orientation.

The term “semiconductor component” as used in this specification intendsto describe a semiconductor device which is at least partially processedin and on the semiconductor substrate or wafer. Partially processedmeans that the semiconductor device is not fully completed and thatfurther processes such as formation of doping regions, contact regionsand metallisation, and dicing are required to obtain an operablesemiconductor device. A semiconductor component typically includes atleast one doping region and at least one metal pad in electricalconnection with this doping region. In case of power devices, asemiconductor component includes a plurality of substantially identicalcells forming together a power device.

The semiconductor device is at least a two-terminal device, an exampleis a power-diode. The semiconductor device can also be a three-terminaldevice such as a power field-effect transistor (FET), insulated gatebipolar transistor (IGBT), junction field effect transistors (JFET), andthyristors to name few. The semiconductor device can also include morethan three terminals. The semiconductor device can generally be anyintegrated product such as power devices and integrated circuits havinga plurality of terminals.

Specific embodiments described herein pertain to, without being limitedthereto, power semiconductor devices and particularly to devices whichare controlled by field-effect.

According to an embodiment, a method for manufacturing semiconductordevices is provided. A semiconductor substrate having a first surface, asecond surface opposite to the first surface and a plurality ofsemiconductor components is provided. The semiconductor substrate has adevice thickness at least in the region of each semiconductor component.At least one metallisation layer is formed on the second surface of thesemiconductor substrate. The metallisation layer has a thickness whichis greater than the device thickness of the semiconductor substrate. Thesemiconductor substrate is diced along separation regions betweenadjacent semiconductor components to obtain separate semiconductordevices.

According to another embodiment, a semiconductor device is provided. Thesemiconductor device includes a semiconductor chip having a firstsurface and a second surface opposite to the first surface. Thesemiconductor chip has a given thickness. At least one metallisationportion is disposed on the second surface of the semiconductor chip,wherein the metallisation portion has a thickness greater than thethickness of the semiconductor chip.

According to another embodiment, a method for manufacturing asemiconductor device is provided. A semiconductor substrate having afirst surface, a second surface opposite to the first surface and aninitial thickness is provided. The second surface of the semiconductorsubstrate is machined to reduce the initial thickness of thesemiconductor substrate down to a device thickness less than the initialthickness at least in selected regions. Metallisation portions areformed on the second surface of the semiconductor substrate in theselected regions, such that the metallisation portions are laterallyspaced apart from each other by separation regions. The semiconductorsubstrate is diced along the separation regions to obtain separatesemiconductor devices.

With reference to FIGS. 1A to 1K, an embodiment of a method formanufacturing semiconductor devices is described. A semiconductorsubstrate 10 is provided which includes a first surface 11 and a secondsurface 12 arranged opposite to the first surface 11. The semiconductorsubstrate 10 is typically a semiconductor wafer and includes a pluralityof doping regions which are not illustrated in FIG. 1A. FIG. 2, whichillustrates enlarged details of a finished semiconductor device,includes doping regions. The doping regions are for example formed atthe first surface 11 and form, for example, anode regions of diodes. Incase of a FET, the doping regions can be body regions and/or sourceregions.

The semiconductor substrate 10 can be made of any semiconductor materialsuitable for manufacturing semiconductor devices. Examples of suchmaterials include, without being limited thereto, elementarysemiconductor materials such as silicon (Si), group IV compoundsemiconductor materials such as silicon carbide (SiC) or silicongermanium (SiGe), binary, ternary or quaternary III-V semiconductormaterials such as gallium arsenide (GaAs), gallium phosphide (GaP),indium phosphide (InP), gallium nitride (GaN), aluminium gallium nitride(AlGaN), indium gallium phosphide (InGaPa) or indium gallium arsenidephosphide (InGaAsP), and binary or ternary II-VI semiconductor materialssuch as cadmium telluride (CdTe) and mercury cadmium telluride (HgCdTe)to name few. The above mentioned semiconductor materials are alsoreferred to as homojunction semiconductor materials. When combining twodifferent semiconductor materials a heterojunction semiconductormaterial is formed. Examples of heterojunction semiconductor materialsinclude, without being limited thereto, silicon (Si_(x)C_(1-x)) and SiGeheterojunction semiconductor material. For power semiconductorapplications currently mainly Si, SiC and GaN materials are used.

Metal pads 13 or other structures of semiconductor components can bearranged on the first surface 11. Metal pads 13 can be, for example,gate pad structures or source pad structures.

The semiconductor substrate or wafer 10 includes a plurality of commonlyprocessed semiconductor components 15, i.e. not yet finishedsemiconductor devices. FIG. 1A exemplifies this by indicating severalsemiconductor components 15 formed in the semiconductor substrate 10. Inthis embodiment, each semiconductor component 15 includes a metal padstructure 13. Each metal pad structure 13 can include one or moreseparate metal pads which can be comprised of the same metal or ofdifferent metals. Furthermore, the metal pads can be of different heightand shape. For example, a metal pad used as source metallisation willtypically be larger than a metal pad used as gate metallisation.

According to one or more embodiments, the processes for formingstructures of the semiconductor components 15 at the first surface 11are finished. This typically includes the formation of metal padstructures 13 which are later used as landing pads for bond wireconnections.

According to one or more embodiments, the semiconductor components 15can also be semi-finished. Typically, most of the desired structuresincluding doping regions located at or near the first surface 11 havealready been formed.

According to one or more embodiments, a carrier substrate 20 can bebonded or otherwise attached to the first surface 11 of thesemiconductor substrate 10. The carrier substrate 20 can be for examplea flat or plane glass wafer which can be attached to the semiconductorsubstrate 10, particularly to the metal pad structure 13, by an adhesivesuch as an adhesive foil.

Carrier substrate 20 will be detached in a later process and thereforeserves only as a temporal support. In this regard, carrier substrate 20mechanically supports the semiconductor substrate 10 during one or moreof the subsequent processes. Furthermore, carrier substrate 20 can alsobe configured to protect the first surface 11 and the semiconductorcomponents 15 during these processes. Generally, carrier substrate 20facilitates handling of the semiconductor substrate 10.

Carrier substrate 20 can be bonded or attached to semiconductorsubstrate 10 after it has already been brought to its final or devicethickness, which is also referred to as given thickness. In a typicalapplication, the carrier substrate 20 will be attached to thesemiconductor substrate 10 before thinning the semiconductor substrate10. This will be described in more detail further below. Typically, thefinal semiconductor substrate 10 can be very thin. For example,semiconductor substrate 10 can have a final or device thickness of about10 μm. A typical range for the final or device thickness is, dependingon the type of the final semiconductor device, between about 1 μm andabout 30 μm, without being limited thereto. According to embodiments,the final or device thickness can be in a range from about 1 μm to about20 μm.

The term “thickness” relates to the vertical thickness in relation tothe orientation of the drawings. Furthermore, the term “devicethickness”, “given thickness” “final thickness” or “given devicethickness” as used herein intends to describe the target thickness whichthe semiconductor substrate has when finished. The semiconductorsubstrate may have this thickness only in selected regions, particularlyin the active region of the semiconductor component. The devicethickness may correspond to the smallest distance between the first andthe second surface of the semiconductor substrate. The semiconductorsubstrate may have the final thickness when provided or can be thinned,during manufacturing, from an “initial thickness” greater than the finalthickness to the final thickness. Thinning may take place only inselected areas.

FIG. 1A illustrates the situation where the semiconductor substrate 10having its final or device thickness is attached to carrier substrate20. Hence, a semiconductor substrate 10 having a first surface 11 and asecond surface 12 opposite to the first surface 11 and a carriersubstrate 20 are provided, wherein the carrier substrate 20 is attachedto the first surface 11 of the semiconductor substrate 10.

In a further process, as illustrated in FIG. 1B, a thin metal ormetal-containing layer 22 is formed on the second surface 12 of thesemiconductor substrate 10. The metal or metal-containing layer 22serves as a contact layer to provide a good ohmic contact to thesemiconductor material of the semiconductor substrate 10. Furthermore,metal or metal-containing layer 22 can be configured to provide abarrier against diffusion of copper (Cu) or other metals used to form athick metallisation layer, which is also referred to as metallisation,as described further below. For example, metal-containing layer, whichwill be referred to hereinafter as barrier layer 22, can be comprised ofAluminium (Al), Chromium (Cr), Titanium (Ti), Nickel (Ni) or Silver (Ag)or any suitable combination or alloy including at least one of thesemetals. Barrier layer 22 can be formed for example by physical vapourdeposition (PVD).

On barrier layer 22, an optional thin seed layer 24, which can also bereferred to as plating start layer, can be formed, for example by PVD.Seed layer 24 provides a surface to facilitate plating of the metal usedto form the thick metallisation layer. For example, when plating copper,seed layer 24 can be comprised of copper, silver, or any other suitablemetal or metal alloy. Barrier layer 22 serves as seed layer whenadditional seed layer 24 is omitted.

Barrier layer 22 and seed layer 24 can be made comparably thin. Forexample, barrier layer 22 can be in the range from about 100 nm to about1 μm, without being limited thereto. Seed layer 24 can be, for example,in the range from about 150 nm to about 1000 nm, typically in the rangefrom about 150 nm to about 500 nm, without being limited thereto.Typically, the respective thicknesses are selected to ensure that theselayers provide their respective desired function.

In a further process, a structured mask layer 30 is formed on the seedlayer 24, or on barrier layer 22 if seed layer 24 is omitted, asillustrated in FIG. 1C. Mask layer 30 has openings 31 formed incoincidence with the regions where the respective semiconductorcomponents 15 are formed. Openings 31 define the size and shape ofmetallisation portions to be subsequently formed. In order to providelarge contact regions to the semiconductor substrate 10, openings 31 canbe sized and shaped, according to embodiments, such that most or all ofthe surface regions of the final semiconductor devices will be coveredby thick metallisation portions.

According to one or more embodiments, mask layer 30 includes structuralelements 32 such as bars which are arranged on those regions 14 of thesemiconductor substrate 10 along which the semiconductor substrate 10will be diced in a later process. These regions are often referred to asdie street, scribe street or saw street. In the following, these regionswill be referred to as die street regions 14. Die street regions 14 runalong the periphery of the semiconductor components 15 and along theboundary between adjacent semiconductor components 15. Openings 31 arearranged outside of die street regions 14.

Mask layer 30 is configured to cover the die street regions 14 whileleaving the regions between adjacent die street regions 14 uncovered.The lateral extension or width of structural elements 32 of the mask 30can be adapted to be in the range of the lateral extension or width ofthe die street regions 14. Typically, the width of a structural element32 between adjacent openings 31 can be selected to provide forsufficient space for the cutting tool. For example, structural elements32 can have a lateral width between about 20 μm to about 100 μm. Inother embodiments, structural elements 32 have a lateral width betweenabout 60 μm to about 80 μm. In other words, adjacent openings 31 arespaced apart from each other by about the width of structural elements32. Moreover, the width of elements 32 is selected such to avoidformation of the thick metallisation in the die street regions 14. Thisfacilitates dicing, such as laser cutting or sawing, of thesemiconductor substrate 10 as explained below.

Furthermore, mask layer 30 can have a thickness (in vertical direction)sufficient for defining the final thickness of the thick metallisationlayer. For example, the thickness of mask layer 30 is chosen such thatit slightly exceeds the desired final thickness of the metallisationlayer to have a safety margin. For example, when the metallisation layershall have a final thickness of about 50 μm, the vertical thickness ofmask layer 30 is slightly larger than 50 μm. It goes without saying thatthe thickness of mask layer 30 is not limited to this value.

Mask layer 30 can be comprised of a resist material, which can bephotosensitive to allow photolithographic structuring. An example is anegative resist such as THB 151. In another embodiment, mask layer 30can be comprised of an epoxy material. Typically, mask layer 30 iscomprised of a material which allows formation of stable structureswhich can withstand the environmental conditions occurring duringsubsequent formation of the thick metallisation.

Mask layer 30 can be formed by different processes. For example, whenusing a thin fluid resist solution, spin-on coating or spray-coating isoften used. When using a higher viscous resist solution or when formingan epoxy mask layer, printing is often more suitable.

In a further process, as illustrated in FIG. 1D, openings 31 can befilled by a metal or a metal-alloy for forming the thick metallisation40. Typically, a metal will be plated using mask layer 30 as a mask toform a structured metallisation. As plating will take place only onmetallic surfaces such as the surface portion of the seed layer 24exposed by mask layer 30, metallisation 40 will be formed in aself-structured manner. No additional mask or etching is needed forstructuring metallisation 40. This is also referred to as patternplating. Plating typically does not start on insulating surfaces such asthe side walls of mask layer 30. Metallisation 40 will therefore beformed on the regions not covered by mask layer 30. Plating can becontinued until metallisation has a thickness similar to the thicknessof the mask layer 30. Typically, plating will be stopped before theplated metal starts to overgrow mask layer 30. As a result, a pluralityof thick metal portions 41 is formed on the second surface 12 of thesemiconductor substrate 10, wherein each metal portion 41 form abackside metallisation of a final semiconductor device.

Thick metallisation 40 can have a thickness of about 20 nm to about 100μm, particularly from about 30 μm to about 50 μm or 60 μm. Typicalvalues are about 50 μm and also up to nearly 100 μm. Metallisation 40will later form a low ohmic carrier plate for the semiconductor chip ofthe final semiconductor device. Hence, metallisation 40 will serve as alow ohmic electrical connection of the semiconductor device.Furthermore, metallisation 40 also provides a means for dissipating heatduring operation of the semiconductor device. A thick metallisationcomprised of copper is particularly suitable for this purpose sincecopper is both thermally and also electrically very conductive. Asufficiently thick metallisation 40 improves not only heat dissipationto the surrounding but also prevents large temperature differenceswithin the semiconductor device. Moreover, the thick metallisation 40mechanically stabilizes the semiconductor chip of the semiconductordevice before it is finally encapsulated.

The metallisation and metallisation portions, respectively, reinforcethe semiconductor substrate or semiconductor chips so that thesemiconductor substrate or the chips can be detached from a carriersystem without breaking it. Carrier substrate 20 may form such a carriersystem. Metallisation portions thus form a high conductive carrier orreinforcing layer, which is permanently attached to the semiconductorsubstrate and the final semiconductor chips, respectively.

According to one or more embodiments, metallisation 40 and metallisationportions 41 have a thickness which is larger than the final or devicethickness of the semiconductor substrate 10. The final thickness ofsemiconductor substrate 10 can be limited to a range sufficient toaccommodate the needed structures. Particularly power devices have adrift region which needs to be sufficiently large to accommodate thedepletion zone formed under blocking conditions. However, when formingdrift regions which are larger than needed, i.e. devices with thicksemiconductor substrates, the resistance during the on-state, theon-state resistance, is increased. It is therefore desired to reduce thethickness of the semiconductor substrate 10 to avoid losses. Desiredthickness ranges for the semiconductor substrate include from about 1 μmto about 60 μm without being limited thereto.

In embodiments, the thick metallisation 40 can be for example at leasttwice as thick as the semiconductor substrate 10 or even larger thanthat. The actual thickness of the metallisation can be selecteddepending on circumstances.

FIG. 1E illustrates an enlarged illustration of a section of FIG. 1D.The boundary between seed layer 24 and thick metallisation 40 isindicated here by a dashed line. For example, when thick metallisation40 is formed by the same metal as seed layer 24, both form together ametallisation structure comprised of a single metal. FIG. 1E alsoillustrates that the surface of metallisation 40 is recessed from thesurface of mask layer 30 by a safety margin to ensure that themetallisation portions 41 remain separated from each other.

Metallisation 40 can be formed, for example by copper plating such aselectrodeposition or electroplating. Suitable electrolyte solutions forcopper plating are Cu-acid electrolytes and sulphidic electrolytes toname few.

Metallisation 40 can also be formed by other suitable processes such aspasting.

When using copper, metallisation 40 can be easily soldered to asubstrate carrier when finalising the semiconductor device. Anothersuitable material for the metallisation 40 is silver (Ag). Metallisation40 can also be formed by suitable alloys or by stack structures havingtwo or more layers. The layers can be of different material such ascopper and tin or silver and tin to name few. It is, however, alsopossible to form a soldering layer on the thick metallisation 40. Forexample, a thin tin (Sn) layer can be formed on a copper metallisationportion. Layered metallisations may have a top layer made of tin. Suchstructures can be soldered by diffusion soldering.

FIG. 1F illustrates a further process. After formation of themetallisation 40, mask layer 30 can be removed. This is, however, onlyoptional and not necessarily required. As a result, a structuredmetallisation 40 having a plurality of thick metal portion 41 remain onthe second surface 12 of the semiconductor substrate 10. Metallisation40 includes a plurality of channel or trenches 42 arranged betweenadjacent metallisation portions 41. The location and course of thetrenches 42 correspond to the course of the die street regions 14between adjacent semiconductor components 15. The trenches or channels42 form separation regions along which the semiconductor substrate willbe later diced. When mask layer 30 is not removed, the separationregions are filled with the material of mask layer 30.

Metallisation portions 41 are still electrically connected with eachother by thin barrier layer 22 and/or seed layer 24. This connectionwill be, however, removed during dicing.

Such prepared substrate 10, as illustrated in FIG. 1F, can be mountedwith the metallisation 40 on a saw frame or scribe frame 45 to supportthe semiconductor substrate 10 during dicing. Saw frame 45 will betypically laminated to metallisation 40. The resulting structure isillustrated in FIG. 1G.

In a further step, as illustrated in FIG. 1H, carrier substrate 20 isdetached from the semiconductor substrate 10.

In a further step, as illustrated in FIG. 1I, semiconductor substrate 10is diced along the die street regions 14 corresponding to the trenches42 of metallisation 40. Therefore, separation of the semiconductorsubstrate 10 takes place only through the semiconductor material and notthrough the thick metallisation 40 which has already been structured inadvance during plating. The die street regions 14 are not covered by thethick metallisation.

When mask layer 30 was not removed in a previous process, mask layer 30will be cut by the separation process so that mask portions may remainon sidewalls of the metallisation portions 41. The separation processmay also remove the mask material.

The approach described herein allows formation of die street regions 14between adjacent semiconductor components 15 which only need to have alateral thickness sufficient for accommodating the cutting tool. Noadditional thick margins as usually required for cutting thick metallayers needs to be provided since metallisation portions 41 areseparated from each other by a process different than the process forcutting the semiconductor substrate 10. Therefore, suitably adaptedcutting processes can be employed which increases the yield.

When separating the electronic components 15 along die street regions14, the separation occurs through material having similar mechanicalproperties. FIG. 1I illustrates that the separation takes place thoughthe semiconductor substrate 10 and the thin barrier layer 22 and platingstart layer 22. The separation does not run through the thickmetallisation portions 41. The semiconductor substrate 10 is a brittlematerial. Different thereto, the thick metallisation is comprised of aductile metal having mechanical properties different to that of thesemiconductor substrate 10. This difference in mechanical propertieswould cause difficulties during dicing when both materials are cut bythe same process. The present approach avoids such difficulties.

According to one or more embodiments, metallisation 40, also referred toas back metallisation, is structured in advance to have separate thickmetallisation portions 41 which are laterally spaced apart from eachother. The space or trenches 42 between the separate metallisationportions 41 are used for dicing. Increasing the thickness of themetallisation regions to improve thermal dissipation therefore does notinterfere with the separation process. In fact, the die street regions14 can be kept as small as needed while increasing the thickness of themetallisation 40. Structuring of the metallisation on the second surface12 of the semiconductor substrate 10 also reduces warping of thesemiconductor substrate 10. As the separation does not cut through thethick metallisation, the separation tools such as saws are also notloaded with metal during separation which improves the separationprocess.

For illustration purposes, die street regions 14 can have a width ofabout 30 μm for dicing semiconductor substrate 10. This size roughlycorresponds to the width of a sawing tool. When separating a copperlayer having a thickness of 50 μm or more by a sawing tool, a“separation region” of at least 200 μm would be needed due to theductile properties of copper. Hence, when dicing a semiconductorsubstrate together with such a thick copper layer, the die streetregions must be in the range of at least 200 μm. The approach using apre-structuring of a thick back metallisation as described herein avoidssuch large die street regions and can therefore minimise waste ofmaterial.

As the metallisation 40 has already been structured in advance duringplating or pasting, separation or dicing can also take place bybreaking. For dicing, any suitable dicing process can be used such asscribe-and-break, laser cutting and sawing. The optional thin metalliclayers 22, 24 do not significantly interfere with the above describeddicing processes.

As a result of the dicing process, separate semiconductor devices 16 areformed each having a semiconductor chip 10′ as illustrated in FIG. 1I.When detaching the semiconductor chips 10′ from the saw frame, the thickmetal portions 41 reduces deformation of the semiconductor chip and thusmechanical stress. Breakage of the chips 10′ can be avoided. Thick metalportions 41 therefore also serve as “handling substrate” for thedelicate and thin semiconductor chips 10′.

In a further process, the semiconductor devices 16 are soldered withtheir metallisation portions 41 to respective substrate carriers 50 asillustrated in FIG. 1J. Substrate carriers 50 are made of an insulatingmaterial and include lead structures 51, 52, 53. Lead structures 51 and53 include bonding pads 51′ and 53′ arranged on an upper side of thecarrier substrate 50 while lead structure 52 includes a pad 52′ to whichthe semiconductor device is attached with its metallisation portion 41formed on the second surface 12 of the semiconductor chip 10′.Electrical connection between metal pad 13 and bonding pads 51′ and 53′,respectively, are provided by bond wires 55.

Finally, the semiconductor device can be encapsulated in a suitableinsulating material 65 such as an epoxy resin to form a semiconductormodule as illustrated in FIG. 1K.

As described above, forming spaced apart metallisation portions 41 onthe second surface 12 of the semiconductor substrate 10 reinforces thesemiconductor substrate 10 and also the final chips 10′. Typically, eachchip 10′ includes at least one thick metallisation portion 41 formed onits second or back surface. Metallisation portions 41 also serve forheat dissipation and an electrical contact to the device. Semiconductordevices or integrated circuits which do not have or which do not need anelectrical contact on the second surface can also benefit from a thickmetallisation portion 41, which will then serve as reinforcing layer andfor heat dissipation.

Furthermore, low-cost substrate carriers 50 can be used since thedevices already include a highly conductive substrate formed by themetallisation portion.

The improved thermal dissipation also improves the robustness andruggedness of the devices, particularly under avalanche conditions andbreakdown. In these situations, the devices produce large lost-heatwhich is easily dissipated by the thick metal portion. Thermal failurecan be avoided and the life-time of the devices extended.

Furthermore, metal portions comprised of copper, silver, tin, metalalloy or metal layer stack can be easily soldered to commonly usedsubstrate carriers by the “solder die attach” or by diffusion soldering.

The semiconductor devices manufactured as described herein have alow-ohmic carrier which is mechanically stable, reinforces the device,compatible with commonly used processes and provides for reliability ofthe final device. This allows a further reduction of the final devicethickness which reduces on-state losses and improves thermaldissipation.

FIG. 2 illustrates an enlarged view of a final semiconductor deviceaccording to a further embodiment. The semiconductor device is solderedto a carrier substrate 50 having lead structures 51, 52, 53 and pads51′, 52′ and 53′, respectively. The semiconductor device is in thepresent embodiment a three-terminal device and includes a metal pad 13′forming a gate electrode and a metal pad 13 forming a source electrode.The gate electrode is insulated from the semiconductor material of chip10′ by a gate dielectric layer 60. Doping regions are also illustrated.Reference numeral 61 denotes a source region while reference numeral 62denotes a body region doped opposite to source region 61 and thesemiconductor material of the chip 10′. A drain region 63 is formed atthe second surface of the chip 10′. A drift region 64 is formed betweendrain region 63 and body region 62. Drain region 63 is electricallyconnected to pad 52′ through metal portion 41 forming here the back-sidemetallisation while source region 61 is electrically connected to metalpad 53′ through bonding wire 55. Gate electrode is electricallyconnected to metal pad 51′ through metal pad 13′ and another bond wire55.

The description is not limited to three-terminal devices such as FETs,illustrated in FIG. 2, or IGBTs but also encompasses two-terminaldevices such as diodes or four or multi-terminal devices and integratedcircuits.

With respect to FIGS. 3A to 3C, a further embodiment is described. Asemiconductor substrate 10 having a first surface 11 and a secondsurface 12′ arranged opposite to the first surface 11 is provided. Thesemiconductor substrate 10 includes a plurality or semiconductorcomponents 15 as described above. Semiconductor components 15 caninclude doping regions, for example formed on or at the first surface 11and metal pad structures 13. The semiconductor substrate 10 has aninitial thickness d₁ which is larger than the final or device thicknessd₂. A carrier substrate 20 can be bonded or otherwise attached to thefirst surface 11 of the semiconductor substrate 10 as described above.

In a further process, as illustrated in FIG. 3B, the second surface 12′of the semiconductor substrate 10 is machined to reduce its thickness.Machining can include any suitable process for reduce the thickness of asemiconductor material or wafer. Examples are mechanical grinding,chemical-mechanical polishing, lapping and etching. Machining the secondsurface 12′ of the semiconductor substrate 10 reduces the initialthickness d₁ of the semiconductor wafer 10 to a target thickness d₂which is less than the initial thickness. Target thickness d₂ can be inthe range given above. Machining the second surface 12′ of thesemiconductor substrate 10 produces a machined second surface 12 asillustrated in FIG. 3B.

In further processes, as illustrated in FIG. 3C, a barrier layer 22 anda seed layer 24 are formed as described above. Further subsequentprocesses can follow as described in connection with FIGS. 1C to 1K.

FIGS. 4A to 4B illustrate a variation of the manufacturing methodaccording to one or more embodiments. Different to the embodimentillustrated in FIGS. 1A to 1K, no mask layer 30 is formed before formingmetallisation layer 40. Hence, metallisation layer 40 is notself-structured when deposited. Metallisation layer 40 has a thicknessgreater then the thickness of the semiconductor substrate 10. Therefore,when dicing the semiconductor substrate 10 together with metallisationlayer 40, semiconductor devices 16 are formed each having a thick metalportion 41 on the second surface of the chip 10′.

This variation may produce wider trenches 42 between adjacentmetallisation portions 41, however, can be used if space-limitation isnot critical. Furthermore, this variation includes fewer manufacturingprocesses than the embodiments described above.

In connection with FIGS. 5A to 5C, a further variation of themanufacturing method according to one or more embodiments will bedescribed. The semiconductor substrate 10 has an initial thickness d₁.An etching mask 37 is formed on the second surface 12′ defining regionswhere the semiconductor substrate 10 is subsequently thinned. Thesemiconductor substrate 10 is then etched, for example by wet-chemicaletching using an alkali etching solution. A suitable etching solution isKOH. Wet-chemical etching can be anisotropic, i.e. exhibit differentetch rates in different crystal orientations. This may lead to theformation of inverse pyramidal structures on the second surface 12′ asillustrated in FIG. 5B. The pyramidal structures form recesses 18 in thesemiconductor substrate 10. Anisotropic etching may also lead to acertain under-etching of etching mask 37.

Selective etching of the second surface 12′ results in a thicknessreduction in selected regions. These regions typically correspond to theactive regions of the respective semiconductor components. Thesemiconductor substrate 10 will then have the final or device thicknessd₂ in the active regions while be thicker in other regions.

After removing the etching mask 37, copper or any other suitable metalis deposited in the recesses 18 to form spaced-apart metallisationportions 41. The semiconductor substrate 10 is subsequently diced alongthe dashed line. Separation occurs only through the semiconductormaterial since the die street regions 14 remain metal free during metaldeposition.

In connection with FIGS. 6A to 6E, a further variation of themanufacturing method according to one or more embodiments will bedescribed. Semiconductor substrate 10 has an initial thickness d₁ andincludes a pn-junction 17 disposed from the first surface 11 by adistance which roughly corresponds to the final thickness d₂. Thesemiconductor substrate 10 is also thinned by etching, for example byKOH. PN junction 17 serves as etch stop.

After having the semiconductor substrate etched down to about the finalthickness d₂, a barrier layer 22 and/or a seed layer 24 can be formed. Amask layer 30 is then formed to define the location of the metalportions 41 as illustrated in FIG. 6C. Subsequently, metal portions 41having a thickness greater than the final thickness d₂ are formed in theopenings 31 of mask layer 30 as described above. Finally, thesemiconductor substrate 10 is diced and the thus separated semiconductordevices 16 soldered to a substrate carrier as illustrated in FIG. 6E.

In connection with FIGS. 7A to 7E, a further variation of themanufacturing method according to one or more embodiments will bedescribed. An etching mask 35 is formed on the second surface 12′ of asemiconductor substrate 10 having an initial thickness d₂. The etchingmask 35 covers the die street regions 14. The semiconductor substrate 10is etched using for example plasma-etching. Another option iswet-chemical etching using an etch solution different than a KOHsolution as described above.

Etching reduces the thickness of the semiconductor substrate 10 from theinitial thickness d₁ to the final or the device thickness d₁ in regionsuncovered by etching mask 35. Etch time can be controlled to ensure thatthe etching is terminated when the desired depth has been reached. Theresulting structure is illustrated in FIG. 7B. The semiconductorsubstrate 10 now has a plurality of recesses 18 which reach to arecessed surface portion forming the second surface 12 of the finaldevice.

As illustrated in FIGS. 7C and 7D, recesses 18 are filled by a metalsuch as copper to form metal portions 41 which are spaced-apart by theremaining wall portions 19 between adjacent recesses 18. Thesemiconductor substrate 10 is then temporarily attached to the saw frame45 and then cut to obtain separate semiconductor devices 16. Afterdetaching the semiconductor chips 10′ from the saw frame 45, the chips10′ are soldered to substrate carrier 50 as described above. The finalstructure is illustrated in FIG. 7E.

In connection with FIGS. 8A to 8E, a further variation of themanufacturing method according to one or more embodiments is described.A carrier wafer 70 is provided which has a plurality openings 71 formedtherein. Carrier wafer can be a glass wafer or any other wafer made of asuitable material. Openings 71 can be formed by any suitable processsuch as etching or drilling. Carrier wafer 70 is then bonded with itsbonding surface 72 to the second surface 12 of a semiconductor substrate10 having the final thickness. Semiconductor substrate 10 can be thinnedprior to bonding as described further above. Furthermore, a barrierlayer and a seed layer, which are not illustrated here, can beoptionally formed.

The resulting structure is illustrated in FIG. 8B which shows theopenings 71 aligned with the regions of the respective semiconductorcomponents. Die or saw street regions 14 are covered by structuralelements of the carrier wafer 70.

The openings 71 of the carrier wafer 70 define the regions wheresubsequently the metallisation portions are formed. Metallisationportions 41 can be formed as described above, for example byelectroplating or pasting.

In a further process, the semiconductor substrate 10 is cut togetherwith the carrier wafer 70 along the die street regions 14. Again, theseparation runs through the material of the semiconductor substrate 10but not through the thick metal portions 41 which were pre-structuredduring deposition. Dicing can be improved when carrier wafer 70 hassimilar mechanical properties as the semiconductor substrate 10. Acarrier wafer made of glass is such a suitable material.

Finally, the separated semiconductor devices are soldered to a substratecarrier 50 and encapsulated as described above. The final structure isillustrated in FIG. 8E.

It is to be understood that the features of the various exemplaryembodiments described herein may be combined with each other, unlessspecifically noted otherwise.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments illustrated and describedwithout departing from the scope of the present invention. Thisapplication is intended to cover any adaptations or variations of thespecific embodiments discussed herein. Therefore, it is intended thatthis invention be limited only by the claims and the equivalentsthereof.

What is claimed is:
 1. A method for manufacturing semiconductor devices,comprising: providing a semiconductor substrate comprising a firstsurface, a second surface opposite to the first surface, and a pluralityof semiconductor components, the semiconductor substrate comprising aninitial thickness, wherein each semiconductor component comprises atleast one doping region and at least one metal pad on the first surfaceof the semiconductor substrate in electrical connection with the dopingregion of the semiconductor component; machining the second surface ofthe semiconductor substrate to reduce the thickness of the semiconductorsubstrate down to a device thickness and to form a flat machined secondsurface; forming at least one of a seed layer and a barrier layer on theflat machined second surface; forming, on the seed layer or barrierlayer, a mask layer comprising a plurality of openings, the openingsdefining the size and location of metallisation portions, the mask layercomprising one of a resist and epoxy material; depositing a metal ormetal-alloy in the openings of the mask layer to form metallisationportions constituting a metallisation layer, the metallisation layercomprising a thickness which is greater than the device thickness of thesemiconductor substrate; and dicing the semiconductor substrate alongseparation regions between adjacent semiconductor components to obtainseparate semiconductor devices; providing substrate carriers eachcomprising at least a first lead structure and at least a second leadstructure which comprises a bonding pad arranged on an upper side of thecarrier substrate; soldering the metallisation portion of a respectivesemiconductor device to the first lead portion of a respective substratecarrier; and electrically connecting the metal pad arranged on the firstsurface of the respective semiconductor device to the bonding padarranged on an upper side of the respective carrier substrate with atleast one bond wire.
 2. The method of claim 1, wherein the devicethickness of the semiconductor substrate is in a range from about 1 μmto about 60 μm.
 3. The method of claim 1, wherein the thickness of themetallisation portions is in a range from about 20 μm to about 100 μm.4. The method of claim 1, wherein the metallisation portions are formedby one of electrodeposition, electroplating and pasting.
 5. The methodof claim 1, wherein the metallisation portions comprise at least one ofcopper, copper-alloy, silver, silver-alloy, multi metal-layer stack,tin, tin-alloy, and a combination thereof.
 6. A method for manufacturingsemiconductor devices, comprising: providing a semiconductor substratecomprising a first surface and a second surface opposite to the firstsurface, the semiconductor substrate comprising a device thickness;providing a carrier wafer comprising a plurality of openings, thecarrier wafer forming a carrier structure; bonding the carrier wafer,comprising the plurality of openings, to the second surface of thesemiconductor substrate so that the carrier structure is attached to thesecond surface of the semiconductor substrate and the carrier structurecovers separation regions of the semiconductor substrate, wherein theopenings of the carrier wafer are arranged in given regions outside ofthe separation regions; depositing a metal or metal-alloy in theopenings of the carrier structure to form laterally spaced apartmetallisation portions comprising a thickness which is greater than thedevice thickness of the semiconductor substrate; and dicing thesemiconductor substrate along the separation regions to obtain separatesemiconductor devices.
 7. The method of claim 1, wherein machining thesecond surface comprises at least one of mechanical grinding,chemical-mechanical polishing, lapping and etching.
 8. The method ofclaim 1, further comprising: removing the mask layer prior to dicing. 9.The method of claim 1, wherein the semiconductor substrate comprises apn-junction disposed from the first surface of the semiconductor deviceby a distance which substantially corresponds to the device thickness,and wherein machining the second surface comprises etching the secondsurface using the pn-junction as an etch stop.